【英文标准名称】:Semiconductordevices.Mechanicalandclimatictestmethods.Hightemperatureoperatinglife
【原文标准名称】:半导体器件.机械和气候试验方法.高温使用寿命
【标准号】:BSEN60749-23-2004+A1-2011
【标准状态】:现行
【国别】:英国
【发布日期】:2004-06-24
【实施或试行日期】:2004-06-24
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:
【英文主题词】:Bondstrength;Climate;Climatictests;Components;Defects;Definitions;Electricalengineering;Electricalmeasurement;Electronicengineering;Electronicequipmentandcomponents;Environmentaltesting;Environmentaltests;High-temperaturetesting;Integratedcircuits;Life(durability);Lifetest;Mechanicaltesting;Moisturetest;Performanceinservice;Prestress;Qualityassurance;Semiconductordevices;Semiconductors;Simulation;Stresstime;Temperaturetest;Testing;Thermalstress;Voltage
【摘要】:Thistestisusedtodeterminetheeffectsofbiasconditionsandtemperatureonsolidstatedevicesovertime.Itsimulatesthedeviceoperatingconditioninanacceleratedway,andisprimarilyusedfordevicequalificationandreliabilitymonitoring.Aformofhightemperaturebiaslifeusingashortduration,popularlyknownas“burn-in”,maybeusedtoscreenforinfantmortalityrelatedfailures.Thedetaileduseandapplicationofburn-inisoutsidethescopeofthisstandard.
【中国标准分类号】:L40
【国际标准分类号】:31_080_01
【页数】:12P.;A4
【正文语种】:英语